1. Not easy to deform, prevent heating and bulging accurate hole position, one-time molding 2. Good toughness 3. High temperature resistance 4. 0.12mm, make phone repairs easier, make reballing work easier. 5. Heated anti-drum design
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Mijing iPH-13 0.12mm BGA Reballing Stencil Planting for iPhone 11 / 11 Pro / 11 Pro Max
Original price was: $86.36.$25.91Current price is: $25.91.
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