1. Precise mesh alignment 2. Magnetic fitting design 3. High-precision machining, precise alignment perfect fit for CPU solder joint 4. AAAA grade T0.12mm stencil, good flexibility 5. High-temperature resistance 500 celsius, no deformation or bulging
Mechanic ICPU 7 in 1 BGA Positioning Planting Tin Platform For iPhone A8 / A9 / A10 / A11 / A12 / A13 / A14
Original price was: $513.21.$153.96Current price is: $153.96.
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