BaKu 3D BGA CPU Tin Planting Mesh Motherboard Repair Tin Planting Table For IPhone A11

1. Fast and stable, precise positioning2. High temperature resistant material, not easy to deform, no bulge, no virtual welding.3. Assist professionals to carry out BGA tin planting in a convenient and safe way.4. For iPhone A115. The strength is more durable and not deformed6. Dimensions: 85 x 85 x 15mm7. Weight: 376 grams