i2C T20 Heating Platform Module For iPhone 13 Series

1. The module can be replaced at will with infinite expansion, a segmental hollow-out design, and can increase, reduce, or take out the buckle2. One key separation and fit safety does not burst tin, intelligent temperature control does not hurt the motherboard3. Push-pull module self-locking design; module automatically springs up when pressed4. 30 seconds heating, 120 seconds stratification5. Notice: only for i2C T20 motherboard heating platform(SKU:EDA0048289)