1. Fast and stable, precise positioning2. High temperature resistant material, not easy to deform, no bulge, no virtual welding.3. Assist professionals to carry out BGA tin planting in a convenient and safe way.4. For iPhone A115. The strength is more durable and not deformed6. Dimensions: 85 x 85 x 15mm7. Weight: 376 grams
BaKu 3D BGA CPU Tin Planting Mesh Motherboard Repair Tin Planting Table For IPhone A11
Original price was: $527.06.$158.12Current price is: $158.12.
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